Ldmos and fabricating method of the same

ABSTRACT

An LDMOS includes a semiconductor substrate. A well is disposed within the semiconductor substrate. A body region is disposed within the well. A first gate electrode is disposed on the semiconductor substrate. A source electrode is disposed at one side of the first gate electrode. The source electrode includes a source contact area and numerous vias. The vias connect to the source contact area. The vias extend into the semiconductor substrate. A first drain electrode is disposed at another side of the first gate electrode and is opposed to the source electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 17/224,108,filed on Apr. 6, 2021. The content of the application is incorporatedherein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a lateral double-diffused MOSFET(LDMOS) and a method of fabricating the same, and more particularly, toan LDMOS with numerous vias inserted into a source of the LDMOS and amethod of fabricating the same.

2. Description of the Prior Art

Double-diffused MOS (DMOS) play an important role among power deviceswith high-voltage processing capabilities. Generally speaking, DMOSincludes vertical double-diffused MOS (VDMOS) and lateraldouble-diffused MOS (LDMOS). LDMOS have been widely used in high-voltageoperating environments, such as CPU power supply, power managementsystem, AC/DC converter, high-power or high-band power amplifier, etc.because of their high operating bandwidth, high operating efficiency,and the planar structure that is easy to integrate with other integratedcircuits.

To increase the linear drain current of an LDMOS, a P-type body regionare disposed at a shallower region. However, the shallower position ofthe P-type body region leads to current leakage because of accumulationof electrons on the substrate.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a new structure of anLDMOS which can increase the linear drain current and to prevent currentleakage.

According to a preferred embodiment of the present invention, an LDMOSincludes a semiconductor substrate. A well is disposed within thesemiconductor substrate. A body region is disposed within the well. Afirst gate electrode is disposed on the semiconductor substrate. Asource electrode is disposed at one side of the first gate electrode,wherein the source electrode includes a source contact area and numerousvias connecting to the source contact area and extending into thesemiconductor substrate. A first drain electrode is disposed at anotherside of the first gate electrode and is opposed to the source electrode.

According to another preferred embodiment of the present invention, afabricating method of an LDMOS includes providing a semiconductorsubstrate, wherein a well is disposed within the semiconductorsubstrate, a body region is disposed within the well, a gate electrodeis disposed on the semiconductor substrate, a drain and a source arerespectively disposed in the semiconductor substrate at two side of thegate electrode. Next, a salicide block (SAB) layer is formed to coverthe source, wherein the SAB layer includes a plurality of rectangularprofiles. Later, a dielectric layer is formed to cover the semiconductorsubstrate. After that, the dielectric layer and the SAB layer are etchedto form a source contact hole directly on the source, wherein the sourcecontact hole includes a trench and numerous via holes. The via holesconnect to the source contact hole, penetrate the SAB layer and extendinto the source, and the trench is only within the dielectric layer.Finally, a conductive layer is formed to fill in the source contact holeto form a source electrode.

According to yet another preferred embodiment of the present invention,a fabricating method of an LDMOS, includes providing a semiconductorsubstrate, wherein a well is disposed within the semiconductorsubstrate, a body region is disposed within the well, a gate electrodeis disposed on the semiconductor substrate, a drain and a source arerespectively disposed in the semiconductor substrate at two side of thegate electrode. Later, a silicide process is performed to form asilicide layer covering the source and the drain.

Subsequently, a dielectric layer is formed to cover the gate electrode,the drain and the source. Next, a first etching process is performed toetch the dielectric layer, the silicide layer and the semiconductorsubstrate to form numerous via holes penetrating the silicide layer andextending into the source. After that, a second etching process isperformed to etch the dielectric layer to form a trench in thedielectric layer directly on the source, wherein the trench connects tovia holes to form a source contact hole. Finally, a conductive layer isformed to fill in the source contact hole and the conductive layerserves as a source electrode connecting to the silicide layer.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 2 depict a fabricating method of an LDMOS according to afirst preferred embodiment of the present invention, wherein:

FIG. 2 is a fabricating stage following FIG. 1 .

FIG. 2A depicts a section view taken along line AA′ in FIG. 2 .

FIG. 2B depicts a section view taken along line BB′ in FIG.

FIG. 2C depicts a section view taken along line CC′ in FIG. 2 .

FIG. 3 to FIG. 5 depict a fabricating method of an LDMOS according to asecond preferred embodiment of the present invention, wherein:

FIG. 4 is a fabricating stage following FIG. 3 ; and

FIG. 5 is a fabricating stage following FIG. 4 .

FIG. 4A depicts a section view taken along line DD′ in FIG. 4 .

FIG. 5A depicts a section view taken along line EE′ in FIG. 5 .

DETAILED DESCRIPTION

FIG. 1 to FIG. 2 depict a fabricating method of an LDMOS according to afirst preferred embodiment of the present invention. FIG. 2A depicts asection view taken along line AA′ in FIG. 2 . FIG. 2B depicts a sectionview taken along line BB′ in FIG. 2 . FIG. 2C depicts a section viewtaken along line CC′ in FIG. 2 .

As shown in FIG. 1 , a semiconductor substrate 10 is provided. A firstgate electrode 12 a and a second gate electrode 12 b are disposed on thesemiconductor substrate 10. The first gate electrode 12 a and the secondgate electrode 12 b respectively include a cap layer (not shown) and agate dielectric layer (not shown). A first drain 14 a and a source 16are disposed in the semiconductor substrate 10 at two side of the firstgate electrode 12 a. The source 16 is in the semiconductor substrate 10which is between the first gate electrode 12 a and the second gateelectrode 12 b. A second drain 14 b is disposed in the semiconductorsubstrate 10 at a side of the second gate electrode 12 and is oppositeto the source 16. Then, a salicide block (SAB) layer 18 is formed tocover the source 16. It is noteworthy that the SAB layer 18 at thesource 16 includes numerous rectangular profiles 18 a/18 b. A space S isbetween adjacent rectangular profiles 18 a/18 b so as to make the source16 does not be entirely covered by the SAB 18. Part of the semiconductorsubstrate 10 is exposed through the space S. The first drain 14 a andthe second drain 14 b do not covered by the SAB layer 18. Please referto FIG. 2A, a well 20 is disposed in the semiconductor substrate 10. Abody region 22 is disposed with in the well 20. A first depth D1 isbetween a bottom of the body region 22 and a top surface of thesemiconductor substrate 10. A second depth D2 is between a bottom of thewell 20 and the top surface of the semiconductor substrate 10, and thesecond depth D2 is greater than the first depth D1. That is, the bottomof the well 20 is deeper than the bottom of the body region 22.

As shown in FIG. 2 , FIG. 2A, FIG. 2B and FIG. 2C, a silicide process isperformed to form a silicide layer 24 on the source 16, the first drain14 a and the second drain 14 b. Later, a dielectric layer 26 is formedto cover the semiconductor substrate 10. For the sake of clarity, thedielectric layer 26 is omitted in FIG. 2 . Then, the dielectric layer26, the SAB layer 18 and the source 16 are etched to form a sourcecontact hole 28 in the dielectric layer 26 directly on the source 16 andextending into the source 16. The source contact hole 28 includes atrench 28 a and numerous via holes 28 b. Each of the via holes 28 bconnects to the trench 28 a. Each of the via holes 28 b penetrates theSAB layer 18 and extends into the source 16. The trench 28 a is only inthe dielectric layer 26.

During the formation of the trench 28 a, the dielectric layer 26directly on the first drain 14 a and the second drain 14 b is etched atthe same etching step as the trench 28 a to form a first drain contacthole 30 a and a second drain contact hole 30 b. The silicide layer 24 onthe first drain 14 a is exposed through the first drain contact hole 30a. The silicide layer 24 on the second drain 14 b is exposed through thesecond drain contact hole 30 b. After the first drain contact hole 30 a,the second drain contact hole 30 b and the trench 28 a are formed withinthe dielectric layer 26 or in other words, after the first drain contacthole 30 a, the second drain contact hole 30 b and the trench 28 apenetrate the dielectric layer 26, etchant is changed to etch the SABlayer 18 on the source 16 and the semiconductor substrate 10 under theSAB layer 18 to form numerous via holes 28 b in the SAB layer 18 and inthe semiconductor substrate 10. The via holes 28 b extend into thesource 16. In FIG. 2B, via holes 28 b and the trench 28 a are divided bydotted lines. After forming via holes 28 b, an ion implantation processis performed to form doping regions 32 b in the well 20 respectivelyunder each of the via holes 28 b.

According to another preferred embodiment of the present invention, thedielectric layer 28, the SAB layer 18 and the semiconductor substrate 10are etched in sequence to form numerous via holes 28 b. Later, thedielectric layer 26 is etched again to form a trench 28 a in thedielectric layer 26 on the source 16, to form a first drain contact hole30 a on the first drain 14 a and to form a second drain contact hole 30b on the second drain 14 b.

Later, a conductive layer fills in the source contact hole 28, the firstdrain contact hole 30 a and the second drain contact hole 30 b. Theconductive layer filling in the source contact hole 28 serves as asource electrode 34. The conductive layer filling in each of the viaholes 28 b form numerous via 34 b. The conductive layer filling in thetrench 28 a form a source contact region 34 a. The source contact region34 a connects to each of the vias 34 b. Each of the vias 34 b does notcontact each other. Furthermore, the conductive layer filling in thefirst drain contact hole 30 a serves as a first drain electrode 36 a.The conductive layer filling in the second drain contact hole 30 bserves as a second drain electrode 36 b. Now, an LDMOS 100 of thepresent invention is completed.

In the following description, FIG. 2 , FIG. 2A, FIG. 2B and FIG. 2C areused to illustrate an LDMOS fabricated by utilizing the first preferredembodiment of the present invention. As shown in FIG. 2 , FIG. 2A, FIG.2B and FIG. 2C, an LDMOS 100 includes a semiconductor substrate 10. Awell 20 is disposed within the semiconductor substrate 10. A body region22 is disposed within the well 20. A first gate electrode 12 a and asecond gate electrode 12 b are disposed on the semiconductor substrate10. The first gate electrode 12 a and the second gate electrode 12 brespectively include a cap layer (not shown) and a gate dielectric layer(not shown). A first drain 14 a and a source 16 are disposed in thesemiconductor substrate 10 at two side of the first gate electrode 12 a.The source 16 is between the first gate electrode 12 a and the secondgate electrode 12 b. A second drain 14 b is disposed in thesemiconductor substrate 10 at a side of the second gate electrode 12 andis opposite to the source 16. A first depth D1 is between a bottom ofthe body region 22 and a top surface of the semiconductor substrate 10.A second depth D2 is between a bottom of the well 20 and the top surfaceof the semiconductor substrate 10, and the second depth D2 is greaterthan the first depth D1. That is, the bottom of the well 20 is deeperthan the bottom of the body region 22. The semiconductor substrate 10 isof a first conductive type, the well 20 is of a second conductive type,the body region 22 is of the first conductive type. Both the first drain14 a and the second drain 14 b are of second conductive type. The source16 is primarily a second conductive type region. But in the secondconductive type region, a doping region 32 a with the first conductivetype is disposed therein. The first conductive type is different fromthe second conductive type. In this embodiment, the first conductivetype is P-type, and the second conductive type is N-type. In otherembodiment, the first conductive type is N-type and the secondconductive type is P-type.

A silicide layer 24 covers the source 16, the first drain 14 a and thesecond drain 14 b. It is noteworthy that an SAB layer 18 is disposed onthe source 16. The SAB layer 18 includes numerous rectangular profiles18 a/18 b. A space S (please refer to FIG. 1 for the positions of thespace S and rectangular profiles 18 a/18 b) is disposed between adjacentrectangular profiles 18 a/18 b. Therefore, the silicide layer 24 coversthe space S. There is no SAB layer 18 on the drain 14 a and the seconddrain 14 b. Therefore, the silicide layer 24 completely covers the firstdrain 14 a and the second drain 14 b.

A source electrode 34 is disposed at one side of the first gateelectrode 12 a, wherein the source electrode 34 includes a sourcecontact area 34 a and numerous vias 34 b connecting to the sourcecontact area 34 a. The vias 34 b extend into the semiconductor substrate10 at the source 16. In details, each of the vias 34 b respectivelypenetrates the SAB layer 18 and extends into the source 16. The sourcecontact area 34 a is completely on the silicide layer 24. The sourcecontact area 34 a does not penetrate the silicide layer 24. That is, thesilicide layer 24 is between the source contact area 34 a and the topsurface of the semiconductor substrate 10.

Furthermore, the number of the vias 34 b should be greater than 2. Inthe first preferred embodiment, there are three vias 34 b shown forexample. But the number of the vias 34 b can be adjusted based ondifferent requirements. Moreover, a third depth D3 is between an end ofone of the vias 34 b and the top surface of the semiconductor substrate10, and the third depth D3 should be at least the same as the firstdepth D1. That is, the end of one of the vias 34 b should be at least asdeep as the bottom of the body region 22. In another embodiment, thethird depth D3 can be greater than the first depth Dl. In other words,the end of one of the vias 34 b is deeper than the bottom of the bodyregion 22. Numerous doping regions 32 b are in the well 20 respectivelyunder each of the vias 34 b. The doping regions 32 b are of the firstconductive type. Each of the doping regions 32 b does not contact eachother.

A first drain electrode 36 a is disposed at another side of the firstgate electrode 12 a and the first drain electrode 36 a is opposed to thesource electrode 34 a. The first drain electrode 36 a contacts thesilicide layer 24 on the first drain 14 a. A second drain electrode 36 bis disposed on another side of the second gate electrode 12 b, and thesecond drain electrode 36 b is opposed to the source electrode 34. Thesecond drain electrode 36 b contacts the silicide layer 24 on the seconddrain 14 b. The first drain electrode 36 a and the second drainelectrode 36 b do not penetrate the silicide layer 24, extend into thefirst drain 14 a or the second drain 14 b. The source electrode 34, thefirst drain electrode 36 a and the second drain electrode 36 b mayindependently include Cu, W, Al, Ti, Ta, TiN, WN or other conductivematerials.

FIG. 3 to FIG. 5 depict a fabricating method of an LDMOS according to asecond preferred embodiment of the present invention. FIG. 4A depicts asection view taken along line DD′ in FIG. 4 . FIG. 5A depicts a sectionview taken along line EE′ in FIG. 5 . Elements in the second preferredembodiment which are substantially the same as those in the firstpreferred embodiment are denoted by the same reference numerals; anaccompanying explanation is therefore omitted.

As shown in FIG. 3 , a fabricating method of an LDMOS includes providinga semiconductor substrate 10. A first gate electrode 12 a and a secondgate electrode 12 b are disposed on the semiconductor substrate 10.Please refer to FIG. 4A first, a well 20 is disposed in thesemiconductor substrate 10. A body region 22 is disposed with in thewell 20. Please refer to FIG. 3 again. A first drain 14 a and a source16 are disposed in the semiconductor substrate 10 respectively at twoside of the first gate electrode 12 a. The source 16 is in thesemiconductor substrate 10 which is between the first gate electrode 12a and the second gate electrode 12 b. A second drain 14 b is disposed inthe semiconductor substrate 10 at a side of the second gate electrode 12and is opposite to the source 16. Next, a silicide process is performedto form a silicide layer 24 covering the source 16, the first drain 14 aand the second drain 14 b.

As shown in FIG. 4 and FIG. 4A, a dielectric layer 26 is formed to coverthe first gate electrode 12 a, the second gate electrode 12 b, the firstdrain 14 a, the second drain 14 b and the source 16. Later, a firstetching process is performed to etch the dielectric layer 26, thesilicide layer 24 and the semiconductor substrate 10 to form numerousvia holes 28 b penetrating the dielectric layer 26, the silicide layer24 and extending into the source 16. As shown in FIG. 5 and FIG. 5A, asecond etching process is performed to etch the dielectric layer 26 toform a trench 28 a, a first drain contact hole 30 a and a second draincontact hole 30 b. The trench 28 a is in the dielectric layer 26directly on the source 16. Each of the via holes 28 b connects to thetrench 28 a so as to form a source contact hole 28. Part of the silicidelayer 24 is exposed through the trench 28 a. The first drain contacthole 30 a and the second drain contact hole 30 b respectively on thefirst drain 14 a and the second drain 14 b. The silicide layer 24 isexposed from the first drain contact hole 30 a and the second draincontact hole 30 b.

Then, an ion implantation process is performed to form doping regions 32b in the well 20 respectively under each of the via holes 28 b. Next, asshown in FIG. 5A, a conductive layer is formed to fill in the sourcecontact hole 28, the first drain contact hole 30 a and the second draincontact hole 30 b. The conductive layer filling in the source contacthole 28 serves as a source electrode 34. The source electrode 34connects to the silicide layer 24. The conductive layer filling in thefirst drain contact hole 30 a serves as a first drain electrode 36 a.The conductive layer filling in the second drain contact hole 30 bserves as a second drain electrode 36 b. Now, an LDMOS 200 of thepresent invention is completed.

In the following description, FIG. 2A, FIG. 2C, FIG. 5 and FIG. 5A areused to illustrate an LDMOS fabricated by utilizing the second preferredembodiment of the present invention. The difference between the LDMOS200 and the LDMOS 100 is that the LDMOS 200 of the second preferredembodiment does not have a SAB layer. Other elements in the LDMOS 200are the same as those in the LDMOS 100. Therefore, only the sectionalview taken along line EE′ is different from the sectional view of theLDMOS 100. Therefore, the different sectional view of the LDMOS 200 isshown in FIG. 5A. The sectional view of LDMOS 200 taken along line FF′is the same as the sectional view of LDMOS 100 taken along line AA′;therefore please refer to FIG. 2A. The sectional view of LDMOS 200 takenalong line GG′ is the same as the sectional view of LDMOS 100 takenalong line CC′; therefore please refer to FIG. 2C.

The source electrode 34 of the LDMOS 200 includes a source contact area34 a and numerous vias 34 b connect to the source contact area 34 a.Each of the vias 34 b extends into the semiconductor substrate 10 at thesource 16. In details, because there is no SAB layer in the LDMOS 200,each of the vias 34 b respectively penetrates the silicide layer 24 andextends into the source 16. The source contact area 34 a is entirely onthe silicide layer 24 and does not penetrate the silicide layer 24.Therefore, the silicide layer 24 is between the source contact area 34 aand the top surface of the semiconductor substrate 10.

Generally, the body region is intentionally disposed at a shallow regionof a semiconductor substrate to increase the linear drain current of theLDMOS. However, electrons accumulated on the semiconductor substrate andcurrent leakage occurs because the body region is at the shallow region.To solve the current leakage, the source electrode of the presentinvention is inserted into the source and extends to contact the bodyregion. In this way, the current leakage can be prevented. Moreover, thelinear drain current will not decreased due to the vias because there isonly several vias inserted into the source.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A fabricating method of an LDMOS, comprising:providing a semiconductor substrate, wherein a well is disposed withinthe semiconductor substrate, a body region is disposed within the well,a gate electrode is disposed on the semiconductor substrate, a drain anda source are respectively disposed in the semiconductor substrate at twoside of the gate electrode; forming a salicide block (SAB) layercovering the source, wherein the SAB layer comprises a plurality ofrectangular profiles; forming a dielectric layer covering thesemiconductor substrate; etching the dielectric layer and the SAB layerto form a source contact hole directly on the source, wherein the sourcecontact hole comprises a trench and a plurality of via holes, theplurality of via holes connect to the source contact hole, penetrate theSAB layer and extend into the source, and the trench is only within thedielectric layer; and forming a conductive layer filling in the sourcecontact hole to form a source electrode.
 2. The fabricating method ofthe LDMOS of claim 1, wherein the source electrode comprises a sourcecontact area and a plurality of vias connecting to the source contactarea, each of the plurality of vias is respectively in each of the viaholes, and the source contact area is in the trench.
 3. The fabricatingmethod of the LDMOS of claim 2, wherein a first depth is between abottom of the body region and a top surface of the semiconductorsubstrate, a second depth is between a bottom of the well and the topsurface of the semiconductor substrate, and the second depth is greaterthan the first depth.
 4. The fabricating method of the LDMOS of claim 3,wherein a third depth is between an end of one of the plurality of viasand the top surface of the semiconductor substrate, and the third depthis greater than the first depth.
 5. The fabricating method of the LDMOSof claim 3, wherein a third depth is between an end of one of theplurality of vias and the top surface of the semiconductor substrate,and the third depth is the same as the first depth.
 6. A fabricatingmethod of an LDMOS, comprising: providing a semiconductor substrate,wherein a well is disposed within the semiconductor substrate, a bodyregion is disposed within the well, a gate electrode is disposed on thesemiconductor substrate, a drain and a source are respectively disposedin the semiconductor substrate at two side of the gate electrode;performing a silicide process to form a silicide layer covering thesource and the drain; forming a dielectric layer covering the gateelectrode, the drain and the source; performing a first etching processto etch the dielectric layer, the silicide layer and the semiconductorsubstrate to form a plurality of via holes penetrating the silicidelayer and extending into the source; performing a second etching processto etching the dielectric layer to form a trench in the dielectric layerdirectly on the source, wherein the trench connects to the plurality ofvia holes, and the trench and the plurality of via holes form a sourcecontact hole; and forming a conductive layer filling in the sourcecontact hole to form a source electrode connecting to the silicidelayer.
 7. The fabricating method of the LDMOS of claim 6, wherein thesource electrode comprises a source contact area and a plurality of viasconnecting to the source contact area, each of the plurality of vias isrespectively in each of the via holes, and the source contact area is inthe trench.
 8. The fabricating method of the LDMOS of claim 7, wherein afirst depth is between a bottom of the body region and a top surface ofthe semiconductor substrate, a second depth is between a bottom of thewell and the top surface of the semiconductor substrate, and the seconddepth is greater than the first depth.
 9. The fabricating method of theLDMOS of claim 8, wherein a third depth is between an end of one of theplurality of vias and the top surface of the semiconductor substrate,and the third depth is greater than the first depth.
 10. The fabricatingmethod of the LDMOS of claim 8, wherein a third depth is between an endof one of the plurality of vias and the top surface of the semiconductorsubstrate, and the third depth is the same as the first depth.
 11. Thefabricating method of the LDMOS of claim 8, further comprising afterforming the plurality of vias, forming a plurality of doping regionsunder each of the via holes.